>> DDR SDRAM
Microsemi’s family of DDR SDRAM based Multi-Chip Packages (MCPs) is designed to give our customers a high density memory solution that also meets the wide data widths necessary for their applications. These high speed memories use a 2ns-prefetch architecture with an interface that allows two data words to be transmitted per clock cycle.
Starting at a density of 128MB (1Gb) in x16, x64 and x72 data width configurations these DDR memories provide many benefits, such as: space savings versus single die packages including CSPs, reduced I/O routing, reduced component count and placements, and extended temperature range testing including industrial and military.
|
DDR SDRAM MCP |
Organization |
Part Number |
Speed |
Volt |
Package |
PDF |
64Mx16 |
W3E64M16S-XSBX |
200-333 Mb/s |
2.5 |
60 PBGA |
Datasheet |
64Mx16 |
W3E64M16S-XNBX |
200-333 Mb/s |
2.5 |
60 PBGA, Thin |
Datasheet |
16Mx64 |
W3E16M64S-XBX |
200-266 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx64 |
W3E32M64SA-XBX |
200-333 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx64 |
W3E32M64S-XBX |
200-333 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx64 |
W3E32M64S-XSBX |
200-333 Mb/s |
2.5 |
208 PBGA |
Datasheet |
16Mx72 |
W3E16M72S-XBX |
200-266 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx72 |
W3E32M72S-XBX |
200-333 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx72 |
W3E32M72S-XSBX |
200-333 Mb/s |
2.5 |
208 PBGA |
Datasheet |
64Mx72 |
W3E64M72S-XSBX |
200-333 Mb/s |
2.5 |
219 PBGA |
Datasheet |
|
Registered DDR SDRAM MCP |
Organization |
Part Number |
Speed |
Volt |
Package |
PDF |
16Mx72 |
W3E16M72SR-XBX |
200-250 Mb/s |
2.5 |
219 PBGA |
Datasheet |
32Mx72 |
W3E32M72SR-XSBX |
200-266 Mb/s |
2.5 |
208 PBGA |
Datasheet |
|