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Microsemi: 256MB LPDDR SDRAM (TI-OMAP)
The W3E64M32LP-XBX is a direct replacement to the Micron MT46H64M32L2CG-6IT:A. It has the same pinout,form and functionality.This 2Gb LPDDR device is a high-speed CMOS,dynamic random-access memory.It is internally configured as a quad-bank DRAM. Each of the X32's 268,435,456-bit banks are organized as 8,192 rows by 1,024 columns by 32 bits.(Contact us for details)
256MB LPDDR SDRAM Flyer download
256MB LPDDR SDRAM Flyer Chinese download
Safely Remove SMD Components in Four Easy Steps
ChipQuik eliminates circuit damage with a specially formulated, low-melting-point alloy ...
SMD component removal has never been easier and safer. Liquid flux and a soldering iron are used to melt ChipQuik's low-temperature alloy, which is specially formulated to stay molten long enough to react with the solder on your component. The SMT device can then be easily removed with a vacuum pen.
1.Specially-formulated alloy melts at only 136 degrees Fahrenheit.
2.Complete SMD-device removal in four easy steps.
3.Fast and easy clean up .
4.Kit includes easy to follow instructions.
(Contact us for details)
Microsemi / PMG HiRel Contactors & Relays
Twinstar now launch new product line Microsemi/PMG Contactors ,Ralays,pressure tranducer serises . Microsemi Power Management Group manufactures high reliability aerospace, military, and commercial relays, remote power controllers, contactors,pressure tranducer timers, sensors from 1 to 200 amp ratings, and custom devices. QPL ratings are maintained for MIL-R-39016 , 6106, & 83536 Specifications. Products are also produced to MIL-R-5757 & 83383 Specifications. MIL-Spec processes are maintained for plating, and environmental testing. Product styles include crystal can, miniature, magnetic latching, reed, hermetically sealed, and welded construction. (Contact us for details)
New Test Socket
Delivers 23GHz and Low Cost
A spring pin based socket system that operates at up to 23 GHz with
-1dB of insertion loss. This new socket system allows the user to test and debug any BGA, QFN, QFP or other custom packages with lead pitches down to 0.5mm. Applications include development, debug, hand test, programming, test of ASIC or FPGA's, package and chip qualification, production prototype, failure analysis and high volume production use. (Contact us for details)
Sullins--Perfect Connector Solution
Sullins Connector Solutions is the leader in developing and delivering reliable, cutting-edge connectors for diverse applications and industries worldwide. Headquartered in San Marcos, California, and privately held, Sullins provides the largest selection of 100% RoHS, UL/CUL approved edgecards and headers in the industry. Their high-level, high-density (0.05 inch) and high-temperature(150c ~250c) connectors are specifically designed for challenging applications used by leading manufacturers and engineers all over the world.
Sullins has successfully provided the perfect connector solution for our clients' diverse and exacting applications for below domain.
Aerospace Communications Wireless Semiconductor
Stackpole's RPC Pulse Withstanding Chip Resistors Now Available In 1% Resistance Tolerances
RALEIGH, NC (August 31, 2010) - Stackpole Electronics, Inc. announced the addition of 1% tolerance to the popular RPC Series of thick film high pulse withstanding chip resistors. Previously this series was only available down to 5% tolerance due to the elimination of the calibration laser trim. Through proprietary materials and processing, Stackpole is now able to offer 1% accuracy with only minor sacrifices to the pulse power handling of the product.(Contact us for details)
NAND BGA Package Provides Up to 16 GByte Solid State Storage
High-Performance Compact Storage Alternative for Embedded Products
PHOENIX, Ariz. (August 27, 2010) Microsemi Corporation’s (Nasdaq:MSCC) Power and Microelectronics Group now offers a high-density Single Level Cell (SLC) NAND solid state storage solution in a single integrated plastic ball grid array (PBGA) package. In 8 and 16 GByte densities, the 27mm x 22mm package offers a 63% space savings over a standard CF card of comparable density. The easy-to-integrate package consumes very little battery life when compared to hard drives and other larger form factor SSD solutions, yet provides high performing data rates. (Contact us for details)
NAND BGA Datasheet download
Product Flyer download
WEDC Receives Supplier Excellence Award
PHOENIX, Ariz. (April 20, 2010) White Electronic Designs Corporation (NASDAQ:WEDC) was recently recognized for its quality and performance by Raytheon Integrated Defense Systems. WEDC received a Supplier Excellence Award at a ceremony held on March 2, 2010. (Contact us for details)
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